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INTEGRATED CIRCUITS
DATA SHEET
TDA8776 10-bit, 500 Msps Digital-to-Analog Converter (DAC)
Product specification Supersedes data of 1995 Mar 28 File under Integrated Circuits, IC02 1996 Jun 04
Philips Semiconductors
Product specification
10-bit, 500 Msps Digital-to-Analog Converter (DAC)
FEATURES * 10-bit resolution * Conversion rate up to 500 MHz * 10K/100K ECL input levels * Internal reference voltage generator * No deglitching circuit required * Internal input register * Power dissipation only 925 mW (typical) * Internal 50 output load (connected to the analog ground) * Very few external components required. GENERAL DESCRIPTION APPLICATIONS
TDA8776
High-speed digital-to-analog conversion for: * High resolution video and graphics * Direct Digital Synthesis (DDS) * Telecommunication * High-speed modems.
The TDA8776 is a 10-bit Digital-to-Analog Converter (DAC) for high resolution video and other high frequency applications. It converts the digital input signal into an analog output voltage at a maximum conversion rate of 500 Msps. No external reference voltage is required and all digital inputs are 10K/100K-ECL compatible.
QUICK REFERENCE DATA SYMBOL VEEA VEED VEEI IEEA IEED IEEI VOUT - VOUT INL DNL fclk(max) tS1 Ptot Notes 1. D0 to D9 connected to either HIGH or LOW level, CLK is HIGH and CLK is LOW. 2. The analog output voltages (VOUT and VOUT) are negative with respect to AGND (see Table 1). The external output resistance between AGND and each of these outputs is typically 50 . 3. A warm-up time is necessary to reach optimal performances. ORDERING INFORMATION PACKAGE TYPE NUMBER NAME TDA8776K 1996 Jun 04 PLCC28 DESCRIPTION plastic leaded chip carrier; 28 leads 2 VERSION SOT261-2 PARAMETER analog supply voltage digital supply voltage input stages digital supply voltage analog supply current digital supply current input stages digital supply current full-scale analog output voltage (peak-to-peak value) DC integral non-linearity DC differential non-linearity maximum clock frequency settling time (differential) total power dissipation note 1 note 1 note 1 note 1 notes 1 and 2; ZL = 50 note 3 note 3 CONDITIONS MIN. -5.46 -5.46 -5.46 - - - 1.7 - - 500 10% to 90% full scale; Fig.9 - - TYP. -5.20 -5.20 -5.20 108 60 10 2.0 0.3 0.2 - 0.5 925 MAX. -4.94 -4.94 -4.94 145 85 15 2.5 0.5 0.45 - - - UNIT V V V mA mA mA V LSB LSB MHz ns mW
Philips Semiconductors
Product specification
10-bit, 500 Msps Digital-to-Analog Converter (DAC)
BLOCK DIAGRAM
TDA8776
handbook, full pagewidth
D9 22
D8 21
D7 20
D6 19
D5 18
D4 17
D3 16
D2 15
D1 14
D0 13
IGND 12 25 VEEI
ECL BUFFERS
COLUMN DECODER
DELAY
28
DGND2
10 ROW DECODER
AGND2
11 24 R-2R DIVIDER
V EED3 VEEA
TDA8776
2
5
3
4
9
8
6
7
27
26
MLD200
DGND1
AGND1
VEED1
VEED2
VOUT2
VOUT1 VOUT1
VOUT2
CLK
CLK
Fig.1 Block diagram.
1996 Jun 04
3
Philips Semiconductors
Product specification
10-bit, 500 Msps Digital-to-Analog Converter (DAC)
PINNING SYMBOL n.c. DGND1 VEED1 VEED2 AGND1 VOUT1 VOUT2 VOUT1 VOUT2 AGND2 VEED3 IGND D0 D1 PIN 1 2 3 4 5 6 7 8 9 10 11 12 13 14 DESCRIPTION not connected digital ground 1 digital supply voltage 1 (-5.2 V) digital supply voltage 2 (-5.2 V) analog ground 1 analog voltage output 1 analog voltage output 2 complementary analog voltage output 1 complementary analog voltage output 2 analog ground 2 digital supply voltage 3 (-5.2 V) input ground for ECL input buffers data input; bit 0 (LSB) data input; bit 1 SYMBOL D2 D3 D4 D5 D6 D7 D8 D9 n.c. VEEA VEEI CLK CLK DGND2 PIN 15 16 17 18 19 20 21 22 23 24 25 26 27 28
TDA8776
DESCRIPTION data input; bit 2 data input; bit 3 data input; bit 4 data input; bit 5 data input; bit 6 data input; bit 7 data input; bit 8 data input; bit 9 (MSB) not connected analog supply voltage (-5.2 V) input supply voltage for ECL input buffers (-5.2 V) complementary clock input clock input digital ground 2
V EED2
V EED1
DGND1
handbook, halfpage
28 DGND2
27 CLK
26 CLK
4
3
2
1
n.c.
AGND1 V OUT1 V OUT2 V OUT1 V OUT2
5 6 7 8 9
25 VEEI 24 V EEA 23 n.c.
TDA8776
22 D9 21 D8 20 D7 19 D6
AGND2 10 V EED3 11
12 D0 13 D1 14 D2 15 D3 16 D4 17 D5 18
MLD201
Fig.2 Pin configuration.
1996 Jun 04
IGND
4
Philips Semiconductors
Product specification
10-bit, 500 Msps Digital-to-Analog Converter (DAC)
LIMITING VALUES In accordance with the Absolute Maximum Rating System (IEC 134). SYMBOL VEEA VEED VEEI VEEA - VEED AGND - DGND VI IOUT/IOUT Tstg Tamb Tj HANDLING PARAMETER analog supply voltage digital supply voltage input stages digital supply voltage supply voltage differential ground voltage differential input voltage total output current storage temperature operating ambient temperature junction temperature ZL = 50 CONDITIONS MIN. -7.0 -7.0 -7.0 -0.5 -0.1 VEEI -5 -55 0 -
TDA8776
MAX. 0.3 0.3 0.3 +0.5 +0.1 0.3 +50 +150 +70 +150 V V V V V V
UNIT
mA C C C
Inputs and outputs are protected against electrostatic discharges in normal handling. However, to be totally safe, it is desirable to take normal precautions appropriate to handling integrated circuits. THERMAL CHARACTERISTICS SYMBOL Rth j-a PARAMETER thermal resistance from junction to ambient in free air VALUE 55 (typ.) UNIT K/W
1996 Jun 04
5
Philips Semiconductors
Product specification
10-bit, 500 Msps Digital-to-Analog Converter (DAC)
TDA8776
CHARACTERISTICS VEEA = V24 to V5 and V10 = -5.46 to -4.94 V; VEED = V3, V4 and V11 to V2 and V28 = -5.46 to -4.94 V; VEEI = V25 to V12 = -5.46 to -4.94 V; VEED and VEEI shorted together; Tamb = 0 to +70 C; AGND, DGND and IGND shorted together; VOUT - VOUT = 2 V (p-p); ZL = 50 ; unless otherwise specified (typical values measured at VEEA = VEED = -5.2 V and Tamb = 25 C). SYMBOL Supply VEEA VEED VEEI IEEA IEED IEEI AGND - DGND Inputs DIGITAL INPUTS (D9 TO D0) AND CLOCK INPUTS (CLK AND CLK) VIL VIH IIL IIH fclk(max) VOUT - VOUT ZO INL DNL LOW level input voltage HIGH level input voltage LOW level input current HIGH level input current maximum clock frequency ZL = 50 VI = -1.8 V VI = -0.9 V -1.9 -1.2 - - 500 -1.8 -0.9 - - - -1.6 -0.8 10 20 - V V A A MHz analog supply voltage digital supply voltage input stages digital supply voltage analog supply current digital supply current input stages digital supply current ground voltage differential note 1 note 1 note 1 note 1 -5.46 -5.46 -5.46 - - - -0.1 -5.20 -5.20 -5.20 108 60 10 - -4.94 -4.94 -4.94 145 85 15 +0.1 V V V mA mA mA V PARAMETER CONDITIONS MIN. TYP. MAX. UNIT
Outputs (referenced to AGND); notes 1 and 2 full-scale analog output voltage (peak-to-peak value) output impedance 1.7 - - - 2.0 50 0.3 0.2 2.5 - 0.5 0.45 V
Transfer function DC integral non-linearity DC differential non-linearity note 3 note 3 LSB LSB
Spurious free dynamic range (fclk = 500 MHz); VEEA = VEED = 5.2 V; Tamb = 25 C; note 4; see Fig.3 SFDR spurious free dynamic range fOUT = 10 MHz fOUT = 50 MHz fOUT = 80 MHz fOUT = 100 MHz -65 - - -52 -69 -60 -59 -59 - - - - dB dB dB dB
1996 Jun 04
6
Philips Semiconductors
Product specification
10-bit, 500 Msps Digital-to-Analog Converter (DAC)
SYMBOL PARAMETER CONDITIONS MIN. TYP.
TDA8776
MAX.
UNIT
Switching characteristics (fclk = 500 MHz); notes 5 and 6; see Figs 8 and 9 tSU;DAT tHD;DAT tPD tS1 tS2 td data set-up time data hold time propagation delay time settling time settling time input to 50% output delay time 10% to 90% full scale change to 1 LSB - 100 - - - - - 400 150 0.8 0.5 2.0 1.4 500 - 0.9 - - 1.5 ps ps ns ns ns ns
Output transients; glitches (fclk = 500 MHz); note 7; see Fig.10 Eg Notes 1. D0 to D9 connected to either HIGH or LOW level, CLK is HIGH and CLK is LOW. 2. The analog output voltages (VOUT and VOUT) are negative with respect to AGND (see Table 1). The external output resistance between AGND and each of these outputs is typically 50 . 3. Due to on-chip regulator behaviour a warm-up time is necessary to reach optimal performances; a typical time is 1 minute. 4. Devices with higher SFDR (min.) can be delivered on request. 5. The worst case characteristics are obtained at the transition from input code 0 to 1023 and if an external load impedance greater than 50 is connected between VOUT or VOUT and AGND in parallel with the external 50 load. The specified values have been measured directly on a 50 load between VOUT and AGND. No further load impedance between VOUT and AGND has been applied. All input data is latched at the falling edge of the clock. 6. The data set-up (tSU;DAT) is the minimum period preceding the falling edge of the clock that the input data must be stable in order to be correctly registered. A negative set-up time indicates that the data may be initiated after the falling edge of the clock and still be recognized. The data hold time (tHD;DAT) is the minimum period following the falling edge of the clock that the input data must be stable in order to be correctly registered. A negative hold time indicates that the data may be released prior to the falling edge of the clock and still be recognized. 7. The definition of glitch energy and the measurement set-up are shown in Fig.10. The glitch energy is measured at the input transition between code 511 to 512. Table 1 Input coding and DAC output voltages (typical values; referenced to AGND regardless of the offset voltage) BINARY INPUT DATA CODE D9 0 1 . 512 . 1022 1023 0 0 . 1 . 1 1 D8 0 0 . 0 . 1 1 D7 0 0 . 0 . 1 1 D6 0 0 . 0 . 1 1 D5 0 0 . 0 . 1 1 D4 0 0 . 0 . 1 1 D3 0 0 . 0 . 1 1 D2 0 0 . 0 . 1 1 D1 0 0 . 0 . 1 1 D0 0 1 . 0 . 0 1 DAC OUTPUT VOLTAGES (V) ZL = 50 VOUT 0 -0.0010 . -0.5 . -0.9990 -1.0 VOUT -1.0 -0.9990 . -0.5 . -0.0010 0 differential glitch energy from code transition 511 to 512 1 2 pV.s
1996 Jun 04
7
Philips Semiconductors
Product specification
10-bit, 500 Msps Digital-to-Analog Converter (DAC)
TDA8776
MGD479
handbook, full pagewidth
75
SFDR (dB) 70
65
60
55
50 1 10
102
f (MHz)
103
Fig.3 Typical spurious free dynamic range (SFDR) as a function of output frequency.
MGD470
handbook, full pagewidth DAC
20
OUTPUT SPECTRUM (dB) 0
-20
-40
-60
-80
-100
0
50
100
150
200
f (MHz)
250
Fig.4 Typical output spectrum; fclk = 500 MHz; fOUT = 10 MHz.
1996 Jun 04
8
Philips Semiconductors
Product specification
10-bit, 500 Msps Digital-to-Analog Converter (DAC)
TDA8776
MGD471
handbook, full pagewidth DAC
20
OUTPUT SPECTRUM (dB) 0
-20
-40
-60
-80
-100
0
50
100
150
200
f (MHz)
250
Fig.5 Typical output spectrum; fclk = 500 MHz; fOUT = 50 MHz.
MGD472
handbook, full pagewidth DAC
20
OUTPUT SPECTRUM (dB) 0
-20
-40
-60
-80
-100
0
50
100
150
200
f (MHz)
250
Fig.6 Typical output spectrum; fclk = 500 MHz; fOUT = 80 MHz.
1996 Jun 04
9
Philips Semiconductors
Product specification
10-bit, 500 Msps Digital-to-Analog Converter (DAC)
TDA8776
MGD473
handbook, full pagewidth DAC
20
OUTPUT SPECTRUM (dB) 0
-20
-40
-60
-80
-100
0
50
100
150
200
f (MHz)
250
Fig.7 Typical output spectrum; fclk = 500 MHz; fOUT = 100 MHz.
handbook, full pagewidth
t SU; DAT
t HD; DAT 0.9 V
input data
stable
1.35 V 1.8 V
0.9 V CLK
MLD202
1.35 V 1.8 V
The shaded areas indicate when the input data may change and be correctly registered. Data input update must be completed within tbf ns after the falling edge of the clock (tSU;DAT is negative; tbf ns). Data must be held at least tbf ns after the falling edge (tHD;DAT = tbf ns).
Fig.8 Data set-up and hold times.
1996 Jun 04
10
Philips Semiconductors
Product specification
10-bit, 500 Msps Digital-to-Analog Converter (DAC)
TDA8776
handbook, full pagewidth
CLK
1.35 V
code 1023 input data (example of a full-scale input transition) code 0 1.35 V 1 LSB 0V (code 0) 10 %
td
50 %
VOUT
90 % 1.0 V (code 1023) t S1 t PD t S2 1 LSB
MLD203
Fig.9 Switching characteristics.
1996 Jun 04
11
Philips Semiconductors
Product specification
10-bit, 500 Msps Digital-to-Analog Converter (DAC)
TDA8776
HP80000
handbook, full pagewidth
f clk /10 DATA GENERATOR f clk /10
(1) (2)
TEK 11801A D9 MSB D8 D7 D6 D5 D4 D3 D2 D1 D0 (LSB) f clk (3) clock VOUT VOUT 20 GHz SAMPLING SCOPE
TDA8776
f clk
(3)
code 511 VOUT VOUT
, ,, ,, ,, ,,
PULSE GENERATOR (MASTER) 1 LSB code 512
(1)
MODEL HP8133A
(2) timing diagram
MLD204
time
The value of the glitch energy is the sum of the shaded areas measured in pV.s.
Fig.10 Glitch energy measurement.
1996 Jun 04
12
Philips Semiconductors
Product specification
10-bit, 500 Msps Digital-to-Analog Converter (DAC)
INTERNAL PIN CONFIGURATIONS
TDA8776
IGND handbook, 4 columns
D0 to D9
internal reference
V EEI
MLD205
Fig.11 D9 to D0.
handbook, halfpage
AGND 50 VOUT VOUT 50 DGND olumns
CLK V EEA bit n bit n
CLK
VEED
MLD206
switches and current generators
MLD207
Fig.12 Analog outputs.
Fig.13 CLK and CLK.
1996 Jun 04
13
Philips Semiconductors
Product specification
10-bit, 500 Msps Digital-to-Analog Converter (DAC)
APPLICATION INFORMATION
TDA8776
handbook, full pagewidth
50 digital input matched lines VTT 1F 10 nF 50 10 nF 50 D5 50 D6 10 nF 50 D7 AGND2 20 10 VOUT2 OUT D9 22 19 18 17 10 nF 50 D4 16 10 nF 50 D3 15 10 nF 50 D2 14 10 nF 50 D1 13 D0 IGND 12 11 VEED3 C
(1)
10 nF
50 digital input matched lines
10 nF 50 D8 10 nF 50 21 9
TDA8776
8
V OUT1 50 analog output matched lines
n.c.
23
7
VOUT2 OUT
V EEA2 C
(1)
24
6
VOUT1
VEEI
AGND1 25 26 27 CLK CLK 28 DGND2 1 n.c. 2 DGND1 3 VEED1 C 4 VEED2
(1)
5
22 F
50 1 F 12 H 10 nF
50 10 nF IN 50 clock input matched lines 22 F 1 F ADJ
LM337T OUT 120 1 F 22 F VTT (-2 V)
VEE (-5.2 V)
75
MBE379
(1) C = 1 F in parallel with 10 nF in parallel with 1 nF; all three mounted close to the supply pin of the DAC with 1 nF the nearest.
Fig.14 Application diagram.
1996 Jun 04
14
Philips Semiconductors
Product specification
10-bit, 500 Msps Digital-to-Analog Converter (DAC)
PACKAGE OUTLINE PLCC28: plastic leaded chip carrier; 28 leads
TDA8776
SOT261-2
eE y X
eE
25
19 18 ZE
A
bp b1 wM
26
28
1
pin 1 index e k 5 e D HD 11 ZD B 4 12 k1
E
HE A A4 A1 (A 3) Lp detail X
vM A
vMB
0
5 scale
10 mm
DIMENSIONS (millimetre dimensions are derived from the original inch dimensions) UNIT
mm
A
4.57 4.19
A1 min.
0.51
A3
0.25
A4 max.
3.05
bp
0.53 0.33
b1
0.81 0.66
D (1)
E (1)
e
eD
eE
HD
HE
k
k1 max.
0.51
Lp
1.44 1.02
v
0.18
w
0.18
y
0.10
Z D(1) Z E (1) max. max.
2.16 2.16
11.58 11.58 10.92 10.92 12.57 12.57 1.22 1.27 11.43 11.43 9.91 9.91 12.32 12.32 1.07
45 o
0.180 inches 0.020 0.01 0.165
0.430 0.430 0.495 0.495 0.048 0.057 0.021 0.032 0.456 0.456 0.020 0.05 0.007 0.007 0.004 0.085 0.085 0.12 0.390 0.390 0.485 0.485 0.042 0.040 0.013 0.026 0.450 0.450
Note 1. Plastic or metal protrusions of 0.01 inches maximum per side are not included. OUTLINE VERSION SOT261-2 REFERENCES IEC JEDEC EIAJ EUROPEAN PROJECTION
ISSUE DATE 92-11-17 95-02-25
1996 Jun 04
15
Philips Semiconductors
Product specification
10-bit, 500 Msps Digital-to-Analog Converter (DAC)
SOLDERING Introduction There is no soldering method that is ideal for all IC packages. Wave soldering is often preferred when through-hole and surface mounted components are mixed on one printed-circuit board. However, wave soldering is not always suitable for surface mounted ICs, or for printed-circuits with high population densities. In these situations reflow soldering is often used. This text gives a very brief insight to a complex technology. A more in-depth account of soldering ICs can be found in our "IC Package Databook" (order code 9398 652 90011). Reflow soldering Reflow soldering techniques are suitable for all PLCC packages. The choice of heating method may be influenced by larger PLCC packages (44 leads, or more). If infrared or vapour phase heating is used and the large packages are not absolutely dry (less than 0.1% moisture content by weight), vaporization of the small amount of moisture in them can cause cracking of the plastic body. For more information, refer to the Drypack chapter in our "Quality Reference Handbook" (order code 9397 750 00192). Reflow soldering requires solder paste (a suspension of fine solder particles, flux and binding agent) to be applied to the printed-circuit board by screen printing, stencilling or pressure-syringe dispensing before package placement. Several techniques exist for reflowing; for example, thermal conduction by heated belt. Dwell times vary between 50 and 300 seconds depending on heating method. Typical reflow temperatures range from 215 to 250 C. Preheating is necessary to dry the paste and evaporate the binding agent. Preheating duration: 45 minutes at 45 C. Wave soldering
TDA8776
Wave soldering techniques can be used for all PLCC packages if the following conditions are observed: * A double-wave (a turbulent wave with high upward pressure followed by a smooth laminar wave) soldering technique should be used. * The longitudinal axis of the package footprint must be parallel to the solder flow. * The package footprint must incorporate solder thieves at the downstream corners. During placement and before soldering, the package must be fixed with a droplet of adhesive. The adhesive can be applied by screen printing, pin transfer or syringe dispensing. The package can be soldered after the adhesive is cured. Maximum permissible solder temperature is 260 C, and maximum duration of package immersion in solder is 10 seconds, if cooled to less than 150 C within 6 seconds. Typical dwell time is 4 seconds at 250 C. A mildly-activated flux will eliminate the need for removal of corrosive residues in most applications. Repairing soldered joints Fix the component by first soldering two diagonallyopposite end leads. Use only a low voltage soldering iron (less than 24 V) applied to the flat part of the lead. Contact time must be limited to 10 seconds at up to 300 C. When using a dedicated tool, all other leads can be soldered in one operation within 2 to 5 seconds between 270 and 320 C.
1996 Jun 04
16
Philips Semiconductors
Product specification
10-bit, 500 Msps Digital-to-Analog Converter (DAC)
DEFINITIONS Data sheet status Objective specification Preliminary specification Product specification Limiting values
TDA8776
This data sheet contains target or goal specifications for product development. This data sheet contains preliminary data; supplementary data may be published later. This data sheet contains final product specifications.
Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one or more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation of the device at these or at any other conditions above those given in the Characteristics sections of the specification is not implied. Exposure to limiting values for extended periods may affect device reliability. Application information Where application information is given, it is advisory and does not form part of the specification. LIFE SUPPORT APPLICATIONS These products are not designed for use in life support appliances, devices, or systems where malfunction of these products can reasonably be expected to result in personal injury. Philips customers using or selling these products for use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting from such improper use or sale.
1996 Jun 04
17
Philips Semiconductors
Product specification
10-bit, 500 Msps Digital-to-Analog Converter (DAC)
NOTES
TDA8776
1996 Jun 04
18
Philips Semiconductors
Product specification
10-bit, 500 Msps Digital-to-Analog Converter (DAC)
NOTES
TDA8776
1996 Jun 04
19
Philips Semiconductors - a worldwide company
Argentina: see South America Australia: 34 Waterloo Road, NORTH RYDE, NSW 2113, Tel. +61 2 805 4455, Fax. +61 2 805 4466 Austria: Computerstr. 6, A-1101 WIEN, P.O. Box 213, Tel. +43 1 60 101, Fax. +43 1 60 101 1210 Belarus: Hotel Minsk Business Center, Bld. 3, r. 1211, Volodarski Str. 6, 220050 MINSK, Tel. +375 172 200 733, Fax. +375 172 200 773 Belgium: see The Netherlands Brazil: see South America Bulgaria: Philips Bulgaria Ltd., Energoproject, 15th floor, 51 James Bourchier Blvd., 1407 SOFIA, Tel. +359 2 689 211, Fax. +359 2 689 102 Canada: PHILIPS SEMICONDUCTORS/COMPONENTS, Tel. +1 800 234 7381, Fax. +1 708 296 8556 China/Hong Kong: 501 Hong Kong Industrial Technology Centre, 72 Tat Chee Avenue, Kowloon Tong, HONG KONG, Tel. +852 2319 7888, Fax. +852 2319 7700 Colombia: see South America Czech Republic: see Austria Denmark: Prags Boulevard 80, PB 1919, DK-2300 COPENHAGEN S, Tel. +45 32 88 2636, Fax. +45 31 57 1949 Finland: Sinikalliontie 3, FIN-02630 ESPOO, Tel. +358 615 800, Fax. +358 615 80920 France: 4 Rue du Port-aux-Vins, BP317, 92156 SURESNES Cedex, Tel. +33 1 40 99 6161, Fax. +33 1 40 99 6427 Germany: Hammerbrookstrae 69, D-20097 HAMBURG, Tel. +49 40 23 52 60, Fax. +49 40 23 536 300 Greece: No. 15, 25th March Street, GR 17778 TAVROS, Tel. +30 1 4894 339/911, Fax. +30 1 4814 240 Hungary: see Austria India: Philips INDIA Ltd, Shivsagar Estate, A Block, Dr. Annie Besant Rd. Worli, MUMBAI 400 018, Tel. +91 22 4938 541, Fax. +91 22 4938 722 Indonesia: see Singapore Ireland: Newstead, Clonskeagh, DUBLIN 14, Tel. +353 1 7640 000, Fax. +353 1 7640 200 Israel: RAPAC Electronics, 7 Kehilat Saloniki St, TEL AVIV 61180, Tel. +972 3 645 0444, Fax. +972 3 648 1007 Italy: PHILIPS SEMICONDUCTORS, Piazza IV Novembre 3, 20124 MILANO, Tel. +39 2 6752 2531, Fax. +39 2 6752 2557 Japan: Philips Bldg 13-37, Kohnan 2-chome, Minato-ku, TOKYO 108, Tel. +81 3 3740 5130, Fax. +81 3 3740 5077 Korea: Philips House, 260-199 Itaewon-dong, Yongsan-ku, SEOUL, Tel. +82 2 709 1412, Fax. +82 2 709 1415 Malaysia: No. 76 Jalan Universiti, 46200 PETALING JAYA, SELANGOR, Tel. +60 3 750 5214, Fax. +60 3 757 4880 Mexico: 5900 Gateway East, Suite 200, EL PASO, TEXAS 79905, Tel. +1 800 234 7381, Fax. +1 708 296 8556 Middle East: see Italy Netherlands: Postbus 90050, 5600 PB EINDHOVEN, Bldg. VB, Tel. +31 40 27 83749, Fax. +31 40 27 88399 New Zealand: 2 Wagener Place, C.P.O. Box 1041, AUCKLAND, Tel. +64 9 849 4160, Fax. +64 9 849 7811 Norway: Box 1, Manglerud 0612, OSLO, Tel. +47 22 74 8000, Fax. +47 22 74 8341 Philippines: Philips Semiconductors Philippines Inc., 106 Valero St. Salcedo Village, P.O. Box 2108 MCC, MAKATI, Metro MANILA, Tel. +63 2 816 6380, Fax. +63 2 817 3474 Poland: Ul. Lukiska 10, PL 04-123 WARSZAWA, Tel. +48 22 612 2831, Fax. +48 22 612 2327 Portugal: see Spain Romania: see Italy Russia: Philips Russia, Ul. Usatcheva 35A, 119048 MOSCOW, Tel. +7 095 926 5361, Fax. +7 095 564 8323 Singapore: Lorong 1, Toa Payoh, SINGAPORE 1231, Tel. +65 350 2538, Fax. +65 251 6500 Slovakia: see Austria Slovenia: see Italy South Africa: S.A. PHILIPS Pty Ltd., 195-215 Main Road Martindale, 2092 JOHANNESBURG, P.O. Box 7430 Johannesburg 2000, Tel. +27 11 470 5911, Fax. +27 11 470 5494 South America: Rua do Rocio 220 - 5th floor, Suite 51, CEP: 04552-903-SAO PAULO-SP, Brazil, P.O. Box 7383 (01064-970), Tel. +55 11 821 2333, Fax. +55 11 829 1849 Spain: Balmes 22, 08007 BARCELONA, Tel. +34 3 301 6312, Fax. +34 3 301 4107 Sweden: Kottbygatan 7, Akalla, S-16485 STOCKHOLM, Tel. +46 8 632 2000, Fax. +46 8 632 2745 Switzerland: Allmendstrasse 140, CH-8027 ZURICH, Tel. +41 1 488 2686, Fax. +41 1 481 7730 Taiwan: PHILIPS TAIWAN Ltd., 23-30F, 66, Chung Hsiao West Road, Sec. 1, P.O. Box 22978, TAIPEI 100, Tel. +886 2 382 4443, Fax. +886 2 382 4444 Thailand: PHILIPS ELECTRONICS (THAILAND) Ltd., 209/2 Sanpavuth-Bangna Road Prakanong, BANGKOK 10260, Tel. +66 2 745 4090, Fax. +66 2 398 0793 Turkey: Talatpasa Cad. No. 5, 80640 GULTEPE/ISTANBUL, Tel. +90 212 279 2770, Fax. +90 212 282 6707 Ukraine: PHILIPS UKRAINE, 2A Akademika Koroleva str., Office 165, 252148 KIEV, Tel. +380 44 476 0297/1642, Fax. +380 44 476 6991 United Kingdom: Philips Semiconductors Ltd., 276 Bath Road, Hayes, MIDDLESEX UB3 5BX, Tel. +44 181 730 5000, Fax. +44 181 754 8421 United States: 811 East Arques Avenue, SUNNYVALE, CA 94088-3409, Tel. +1 800 234 7381, Fax. +1 708 296 8556 Uruguay: see South America Vietnam: see Singapore Yugoslavia: PHILIPS, Trg N. Pasica 5/v, 11000 BEOGRAD, Tel. +381 11 825 344, Fax.+381 11 635 777
For all other countries apply to: Philips Semiconductors, Marketing & Sales Communications, Building BE-p, P.O. Box 218, 5600 MD EINDHOVEN, The Netherlands, Fax. +31 40 27 24825 (c) Philips Electronics N.V. 1996
Internet: http://www.semiconductors.philips.com/ps/ (1) ADDRESS CONTENT SOURCE April 2, 1998 SCA49
All rights are reserved. Reproduction in whole or in part is prohibited without the prior written consent of the copyright owner. The information presented in this document does not form part of any quotation or contract, is believed to be accurate and reliable and may be changed without notice. No liability will be accepted by the publisher for any consequence of its use. Publication thereof does not convey nor imply any license under patent- or other industrial or intellectual property rights. Printed in The Netherlands
537021/1200/02/pp20 Date of release: 1996 Jun 04 Document order number: 9397 750 00887

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